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  •  Offer Message
    a) For Cutting Glass and other precision mold
    b) For high pressure and deep Cutting
    c) For cutting and polishing Electronic Component and Optic Limbs
    d) For processing semiconductor wafer, ceramic and CPS materials
Ultra Thin Metal and Electroplated Diamond & CBN Cutting Disc
Business Opportunity DetailsBusiness Contact Informations
Date : July 28, 2007Company : Bondflex abrasives jiangyan co ltd
Offer type : [S] SELL :: Product SalesCountry : china china
Sector | Categorie : Industrial Equipment | Tools, Machines Tools and Other
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